Features
1. Rapid heating, only 10s to reach 250
2. Built-in temperature sensor, stable output temperature.
3. Cool or hot air can be selected to preheat or cool chips.
4. The preheater can be used with rework stations to process BGA or other flake ICs.

Specifications

Features
1. Imported infrared ceramic heater, having fast heating, high efficiency, long life time.
2. Build-in thermometer can check temperature of PCB conveniently.
3. Closed loop of sensor, PID control, temperature accurate and stable.
4. Suitable for PCB preheating and other process which requires whole and even heating.
5. ESD safe design.

Specifications

Features
1. Special heater, surface temperature distributes evenly.
2. Closed loop of sensor, PID control, precise and stable temperature.
3. Two switches control power supply and heating separately. Actual temperature of the plate will also display even under unheated condition, can avoid accidents.
4. Suitable for PCB preheating and other process which requires whole and even heating.
5. ESD safe design.

Specifications

Features
1. Combined working plate, easier for equipment maintenance.
2. Heating upward and downward simultaneously, suitable for de-soldering BGA and other chips which need preheating.
3. Adjustable according to different sizes of PCBs.
4. Picking up and placing chips function can be selected as per requirements.

Specifications